Semiconductor device

ABSTRACT

A partial isolation insulating film provided between MOS transistors in an NMOS region and a PMOS region, respectively, has a structure in which a portion protruding upward from a main surface of an SOI layer is of greater thickness than a trench depth, namely, a portion (isolation portion) extending below the surface of the SOI layer, and the SOI layer under the partial isolation insulating film is of greater thickness than the isolation portion.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to semiconductor devices, and in particular to asemiconductor device having a hybrid trench isolation structure thatcombines a full trench isolation structure and a partial trenchisolation structure.

2. Description of the Background Art

A semiconductor device of SOI (Silicon On Insulator) structure(hereafter called “SOI device”), which is formed on an SOI substrateincluding a buried oxide film and an SOI layer provided on a siliconsubstrate, allows parasitic capacitance reduction and operates withstability at high speed with low power consumption, and is used for aportable device and the like.

By way of example, an SOI device has a full trench isolation (FTI)structure in which elements are electrically isolated by a full trenchisolation insulating film formed by providing a trench that reaches theburied oxide film in the surface of the SOI layer, and filling thetrench with an insulating material.

However, there have been various kinds of problems resulting from asubstrate floating effect, such as the accumulation of carriers (holesin an NMOS) generated by an impact ionization phenomenon in a channelforming region which leads to kinks, deterioration of operatingbreakdown voltage, and the occurrence of frequency dependency of delaytime due to potential instability of the channel forming region.

Thus devised is a partial trench isolation (PTI) structure which isformed by providing a trench in the surface of the SOI layer whileleaving the SOI layer in a predetermined thickness between the bottom ofthe trench and the buried oxide film, and filling the trench with aninsulating material.

The PTI structure allows movements of carriers through a well regionunder the trench isolation insulating film thus preventing theaccumulation of carriers in a channel forming region, and also allowsthe potential of the channel forming region to be fixed through the wellregion, not causing the various problems resulting from the substratefloating effect.

In addition, there has been proposed a hybrid trench isolation (HTI)structure that combines the respective characteristics of the FTIstructure and the PTI structure, as described in Japanese PatentApplication Laid-Open Nos. 2001-230315 (FIG. 1) and 2000-243973 (FIGS.55 to 57).

The HTI structure has a cross-sectional shape that includes a fulltrench portion reaching the buried oxide film through the SOI layer, anda partial trench portion having the SOI layer provided thereunder.

With smaller semiconductor elements, the likelihood is that a gatelength of a transistor, spacing between wirings, and the like will beshortened, and dimensions in the vertical direction (directionperpendicular to a substrate main surface) such as a gate height, thethickness of an interlayer insulating film, the thickness of an SOIlayer, and the like will be correspondingly reduced as well, resultingin a scale-down of the whole device.

With the progress of scale-down, however, it becomes necessary to reducethe thickness of the isolation oxide film in the PTI structure as well.When a gate electrode extends over the isolation oxide film, theparasitic capacitance of the gate electrode may increase too much toignore.

SUMMARY OF THE INVENTION

It is an object of this invention to provide a semiconductor device thatprevents an increase in parasitic capacitance of a gate electrode evenwith side reduction of the semiconductor device.

In a first aspect of this invention, a semiconductor device includes: anSOI substrate including a substrate part serving as a base, a buriedoxide film provided on the substrate part, and an SOI layer provided onthe buried oxide film; first and second element isolation insulatingfilms provided in first and second regions on the SOI layer,respectively; and a third element isolation insulating film providedbetween the first and second regions. The first and second elementisolation insulating films have a partial trench isolation structurehaving the SOI layer provided thereunder. The third element isolationinsulating film at least partly includes a full trench isolationstructure reaching the buried oxide film through the SOI layer. Thefirst and second element isolation insulating films have a structure inwhich a protruding portion protruding upward from a main surface of theSOI layer is of greater thickness than an isolation portion extendingbelow the main surface of the SOI layer.

Since the first and second element isolation insulating films have astructure in which the protruding portion protruding upward from themain surface of the SOI layer is of greater thickness than the isolationportion extending below the main surface of the SOI layer, when a gateelectrode extends over the first and second element isolation insulatingfilms, a parasitic capacitance increase of the gate electrode can besuppressed, which leads to favorable device operation.

In a second aspect of this invention, a semiconductor device includes:an SOI substrate including a substrate part serving as a base, a buriedoxide film provided on the substrate part, and an SOI layer provided onthe buried oxide film; first and second element isolation insulatingfilms provided in first and second regions on the SOI layer,respectively; and a third element isolation insulating film providedbetween the first and second regions. The first element isolationinsulating film has a partial trench isolation structure having the SOIlayer provided thereunder. The second and third element isolationinsulating films at least partly include a full trench isolationstructure reaching the buried oxide film through the SOI layer. Thefirst element isolation insulating film has a structure in which aprotruding portion protruding upward from a main surface of the SOIlayer is of greater thickness than an isolation portion extending belowthe main surface of the SOI layer. The second element isolationinsulating film only has the full trench isolation structure. The thirdelement isolation insulating film has a hybrid trench isolationstructure including the full trench isolation structure and the partialtrench isolation structure, the partial trench isolation structure beingformed such that the protruding portion is of greater thickness than theisolation portion, and the under-isolation SOI layer is of greaterthickness than the isolation portion. The protruding portion of thesecond element isolation insulating film and the protruding portion ofthe full trench isolation structure of the third element isolationinsulating film are of smaller thickness than the protruding portion ofthe first element isolation insulating film.

Since the protruding portion of the second element isolation insulatingfilm and the protruding portion of the full trench isolation structureof the third element isolation insulating film are of smaller thicknessthan the protruding portion of the first element isolation insulatingfilm, a range of gate length variation is reduced, which allows easydimensional control of the gates.

These and other objects, features, aspects and advantages of thisinvention will become more apparent from the following detaileddescription of this invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 illustrate cross-sectional views of a configuration of atransistor and a partial isolation insulating film before and after ascale-down, respectively;

FIG. 3 shows a plane configuration of an SOI device according to a firstpreferred embodiment of this invention;

FIGS. 4 and 5 show cross-sectional configurations of the SOI deviceaccording to the first preferred embodiment;

FIGS. 6 to 12 illustrate cross-sectional views for explaining a methodof manufacturing the SOI device according to the first preferredembodiment;

FIG. 13 illustrates a plan view for explaining a gate length variationof a gate electrode;

FIGS. 14 to 16 illustrate cross-sectional views for explaining the gatelength variation of the gate electrode;

FIG. 17 shows the relationship between a range of gate length variationand a thickness of a protruding portion of an isolation insulating film;

FIG. 18 shows a cross-sectional configuration of an SOI device accordingto a second preferred embodiment of this invention;

FIGS. 19 to 20 illustrate cross-sectional views for explaining a methodof manufacturing the SOI device according to the second preferredembodiment;

FIG. 21 shows a cross-sectional configuration of a modification of theSOI device according to the second preferred embodiment;

FIG. 22 shows a plane configuration of the modification of the SOIdevice according to the second preferred embodiment; and

FIG. 23 shows a cross-sectional configuration of the modification of theSOI device according to the second preferred embodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

<Introduction>

Prior to descriptions of preferred embodiments according to thisinvention, a process that has led to a technical concept of thisinvention will be described with reference to FIGS. 1 and 2.

FIGS. 1 and 2 illustrate cross-sectional views of a configuration of atransistor and a partial isolation insulating film before and after ascale-down.

In FIG. 1 showing a before-scale-down state, two MOS transistors T10 areprovided on an SOI substrate SB consisting of a silicon substrate 1, aburied oxide film 2 provided on the silicon substrate 1, and an SOIlayer 3 provided on the buried oxide film 2.

The MOS transistors T10 are isolated from each other by a partialisolation insulating film PT10 having the SOI layer 3 providedthereunder.

The MOS transistors T10 each include a gate insulating film 101 providedselectively on the SOI layer 3, a gate electrode 102 provided on thegate insulating film 101, and a sidewall insulating film 103 provided tocover the side surfaces of the gate electrode 102.

The MOS transistor T10 on the left in FIG. 1 represents itscross-sectional shape in the gate length direction. The MOS transistorT10 on the right represents its cross-sectional shape in the gate widthdirection, where part of the gate electrode 102 extends over the partialisolation insulating film PT10.

A source/drain layer 105 is provided in the surface of the SOI layer 3outside the sidewall insulating film 103 of the MOS transistor T10, andan extension layer 104 is provided at a shallower position than thesource/drain layer 105.

The extension layer 104 which is an impurity layer so formed as to be ashallower junction than the source/drain layer has the same conductivitytype as the source/drain layer, and functions as the source/drain layer.Thus the extension layer 104 should be called a source/drain extensionlayer, but is called an extension layer for the convenience ofdescription.

Assume that the gate length of the MOS transistor T10 is Lg1, thethickness of the SOI layer 3 is t_(SOI1), and the thickness of thepartial isolation insulating film PT10 is t_(tot1). In addition, assumethat the thickness of a portion (called “protruding portion”) of thepartial isolation insulating film PT10 protruding upward from the mainsurface of the SOI layer 3 is t₁, and the thickness of a portion (called“isolation portion”) of the partial isolation insulating film PT10extending below the main surface of the SOI layer 3 is t₂. The sum ofthe thicknesses t₁ and t₂ is equal to the thickness t_(tot1).

FIG. 2 shows a semiconductor device of this configuration that has beenscaled down with a scale ratio of 0.7.

In FIG. 2, two MOS transistors T20 are provided on the SOI substrate SB,and are isolated from each other by a partial isolation insulating filmPT20 having the SOI layer 3 provided thereunder.

The MOS transistors T20 each include a gate insulating film 201 providedselectively on the SOI layer 3, a gate electrode 202 provided on thegate insulating film 201, and a sidewall insulating film 203 provided tocover the side surfaces of the gate electrode 202.

The MOS transistor T20 on the left in FIG. 2 represents itscross-sectional shape in the gate length direction. The MOS transistorT20 on the right represents its cross-sectional shape in the gate widthdirection, where part of the gate electrode 202 extends over the partialisolation insulating film PT20.

A source/drain layer 205 is provided in the surface of the SOI layer 3outside the sidewall insulating film 203 of the MOS transistor T20, andan extension layer 204 is provided at a shallower position than thesource/drain layer 205.

Assume that the gate length of the MOS transistor T20 is Lg2, thethickness of the SOI layer 3 is t_(SOI2), and the thickness of thepartial isolation insulating film PT20 is t_(tot2). In addition, assumethat the thickness of a portion of the partial isolation insulating filmPT20 protruding upward from the main surface of the SOI layer 3 is t₃,and the thickness of a portion of the partial isolation insulating filmPT20 extending below the main surface of the SOI layer 3 is t₄. The sumof the thicknesses t₃ and t₄ is equal to the thickness t_(tot2).

With a scale ratio of 0.7, the gate length Lg2 becomes substantially 0.7times the gate length Lg1, the thickness t_(SOI2) becomes substantially0.7 times the thickness t_(SOI1), and the thickness t_(tot2) becomessubstantially 0.7 times the thickness t_(tot1).

In this manner, a scale-down of the semiconductor device is done byscaling down most of the elements according to the scale ratio inhorizontal and vertical directions with respect to the main surface ofthe semiconductor substrate.

In response to the thickness reduction of the SOI layer 3 to 0.7 timesthe thickness t_(SOI1), the thickness of the portion of the partialisolation insulating film PT20 extending within the SOI layer 3 isreduced to 0.7 times the thickness t₂, and the total thickness t_(tot2)is proportionally reduced as well. This causes an increase in parasiticcapacitance of the gate electrode 202 extending over the partialisolation insulating film PT20, which leads to unfavorable deviceoperation.

For the thickness of the isolation insulating film not to be reducedwith a scale-down, the thickness of the portion extending below the mainsurface of the SOI layer, namely, a trench depth, should be increased.In that case, however, the thickness of the SOI layer provided under theisolation insulating film is reduced, causing a possible increase inresistance value of that portion. In addition, the resistance value ofthe SOI layer will vary when the trench depth cannot be controlled withprecision.

The inventors conducted a further study in view of the above, andreached a technical concept of increasing the thickness of the portionof the isolation insulating film protruding upward from the main surfaceof the SOI layer, rather than the thickness of the portion extendingbelow the main surface of the SOI layer. Concretizations of thistechnical concept will be discussed in the preferred embodimentsaccording to this invention described below.

A. First Preferred Embodiment

<A-1. Device Structure>

FIG. 3 illustrates a plan view of a configuration of an SOI device 100according to a first preferred embodiment of this invention.

In FIG. 3, an N-channel type MOS transistor T1 and a P-channel type MOStransistor T2 are provided adjacently to each other so that theirrespective gate electrodes 12 and 22 are placed in parallel in the gatelength direction.

Body fixing regions BR1 and BR2 for potential fixation are providedbeyond the ends on one side in the gate width direction of the gateelectrodes 12 and 22 of the MOS transistors T1 and T2, respectively.

The region where the MOS transistor T1 is provided and the region wherethe MOS transistor T2 is provided are electrically isolated from eachother, which is indicated by a broken line X for the convenience ofdescription in FIG. 3.

FIGS. 4 and 5 illustrate cross-sectional views of the configuration ofthe SOI device 100, taken along the lines A-A and B-B in FIG. 3,respectively.

As shown in FIG. 4, the SOI device 100 is provided on an SOI substrateSB consisting of a silicon substrate 1, a buried oxide film 2 providedon the silicon substrate 1, and an SOI layer 3 provided on the buriedoxide film 2.

The surface of the SOI substrate SB is divided into an NMOS region NR(first region) where the N-channel type MOS transistor T1 is provided,and a PMOS region PR (second region) where the P-channel type MOStransistor T2 is provided. The two regions are electrically isolatedfrom each other by a hybrid isolation insulating film HT1 having thehybrid trench isolation (HTI) structure that combines the FTI structureand the PTI structure.

The hybrid isolation insulating film HT1 has a substantially T-shapedcross-sectional shape that includes the FTI structure reaching theburied oxide film 2 through the SOI layer 3 at its center, and the PTIstructure having the SOI layer 3 provided thereunder at its both ends.

It is to be noted that the hybrid trench isolation structure is notrestricted to have the substantially T-shape mentioned above, but mayhave any cross-sectional shape as long as it includes the PTI and FTIstructures.

In each of the NMOS region NR and the PMOS region PR, a partialisolation insulating film PT1 is provided between MOS transistors.

Although FIGS. 3 and 4 only show one MOS transistor T1 and one MOStransistor T2 for the convenience of description, the respective numbersof the MOS transistors T1 and T2 are not restricted to these numbers.

As shown in FIG. 4, the MOS transistor T1 includes a gate insulatingfilm 11 provided selectively on the SOI layer 3, a gate electrode 12provided on the gate insulating film 11, and a sidewall insulating film13 provided to cover the side surfaces of the gate electrode 12.

A source/drain layer 15 is provided in the surface of the SOI layer 3outside the sidewall insulating film 13 of the MOS transistor T1, and anextension layer 14 is provided at a shallower position than thesource/drain layer 15.

The MOS transistor T2 includes a gate insulating film 21 providedselectively on the SOI layer 3, a gate electrode 22 provided on the gateinsulating film 21, and a sidewall insulating film 23 provided to coverthe side surfaces of the gate electrode 22.

A source/drain layer 25 is provided in the surface of the SOI layer 3outside the sidewall insulating film 23 of the MOS transistor T2, and anextension layer 24 is provided at a shallower position than thesource/drain layer 25.

The extension layers 14 and 24 which are impurity layers so formed as tobe shallower junctions than the source/drain layers have the sameconductivity type as the source/drain layers, and function as thesource/drain layers. Thus the extension layers 14 and 24 should becalled source/drain extension layers, but are called extension layersfor the convenience of description.

In addition, an interlayer insulating film 5 made of silicon oxide film,for example, is provided to cover the overall surface of the SOIsubstrate SB, and a plurality of contact portions CH are provided to beconnected to the source/drain layers 15 and 25 through the interlayerinsulating film 5. Each of the contact portions CH is connected to awiring layer WR over the interlayer insulating film 5.

Multiple interlayer insulating films are additionally laminated on theinterlayer insulating film 5, but are not shown for simplicity in FIG.4.

Further, as shown in FIG. 5, the body fixing region BR1 in the region NRwhere the MOS transistor T1 is provided and the SOI layer 3 directlybelow the gate electrode 12 of the MOS transistor T1 are electricallyconnected to each other through the SOI layer 3 (under-isolation SOIlayer) under the partial isolation insulating film PT1 having thepartial isolation structure. Such connection is also established betweenthe body fixing region BR2 in the region PR and the SOI layer 3 directlybelow the gate electrode 22 of the MOS transistor T2.

<A-2. Manufacturing Method>

Now a method of manufacturing the SOI device 100 will be described.FIGS. 6 to 12 illustrate cross-sectional views of the manufacturingsteps in order.

First, in a FIG. 6 step, the SOI substrate SB consisting of the siliconsubstrate 1, the buried oxide film 2 and the SOI layer 3 is prepared bythe SIMOX method, boding method, or the like. The thickness of the SOIlayer 3 is 20 to 200 nm, and the thickness of the buried oxide film 2 is10 to 400 nm.

Next, a pad oxide film PDX of 5 to 30 nm in thickness is formed on theSOI layer 3 by thermal oxidation, and then a silicon nitride film SN of100 to 200 nm in thickness is deposited thereon by CVD at a formingtemperature of 600 to 800 C.°.

Then, a resist mask RM1 is formed on the silicon nitride film SN bypatterning. The resist mask RM1 has openings in which trenches are to beformed.

Subsequently, in a FIG. 7 step, the silicon nitride film SN, the padoxide film PDX and the SOI layer 3 are patterned by etching with theresist mask RM1 as a mask, to form partial trenches TR1 and TR2 in theSOI layer 3. Conditions for this etching are adjusted so that the SOIlayer 3 in a predetermined thickness, specifically in a thicknessexceeding half the thickness thereof, remains at the bottoms of thetrenches TR1 and TR2, without the SOI layer 3 being etched completely toexpose the buried oxide film 2.

The resist mask RM1 is removed afterward, and then in a FIG. 8 step, theexposed SOI layer 3 is thermally oxidized at a temperature of 700 to1100 C.°, to form a silicon oxide film OX1 of 5 to 30 m in thickness onthe surface of the SOI layer 3.

Next, in a FIG. 9 step, a resist mask RM2 is formed on the SOI substrateSB by patterning. The resist mask RM2 has a pattern with an opening OP1that only corresponds to a predetermined portion of the trench TR1. Morespecifically, the opening OP1 only corresponds to the portion reachingthe buried oxide film 2 through the SOI layer 3 in the hybrid isolationinsulating film HT1 (FIG. 4) which will be formed later.

Next, in a FIG. 10 step, the trench TR1 is etched in accordance with theopening pattern of the resist mask RM2, and the buried oxide film 2 isexposed by etching, to form a trench TR11. The resist mask RM2 is thenremoved.

Next, in a FIG. 11 step, a silicon oxide film OX2 of 150 to 600 nm inthickness is formed on the overall surface of the SOI substrate SB, tofill the trenches TR1, TR11 and TR2 completely with the silicon oxidefilm OX2.

The silicon oxide film OX2 is formed by HDP (High Density Plasma)-CVD,for example. The HDP-CVD uses plasma of higher density by one or twodigits than common plasma CVD, and deposits an oxide film by performingspattering and deposition at the same time, thus obtaining a siliconoxide film of favorable quality.

The silicon oxide film OX2, which is formed not only in the trenches TR1and TR2 but to cover the overall surface of the SOI substrate SB, ispolished and planarized by a CMP process to the point where at least thesurface of the silicon nitride film SN is exposed. The polishing may beperformed until the silicon nitride film SN is reduced substantially tohalf in thickness.

Next, in a FIG. 12 step, the silicon nitride film SN and the pad oxidefilm PDX are removed by wet etching or dry etching, to obtain the hybridisolation insulating film HT1 having the HTI structure and the partialisolation insulating film PT1 having the PTI structure.

Although the existence of the silicon oxide film OX1 is indicated on thesurface of the SOI layer 3 facing the hybrid isolation insulating filmHT1 and the partial isolation insulating film PT1 in FIG. 12, they areregarded as being integrated and are not specifically indicated in FIG.4.

After that, on active regions defined by the hybrid isolation insulatingfilm HT1 and the partial isolation insulating film PT1, the gateinsulating films 11 and 12, and the gate electrodes 12 and 22 areformed, ion implantations are performed with the gate electrodes 12 and22 as masks to form the extension layers 14 and 24, respectively, andthe sidewall insulating films 13 and 23 are formed on the side surfacesof the gate electrodes 12 and 22, respectively. Then, ion implantationis performed with the gate electrode 12 and the sidewall insulating film13 as a mask to form the source/drain layer 15, while ion implantationis performed with the gate electrode 22 and the sidewall insulating film23 as a mask to form the source/drain layer 25.

Finally, the interlayer insulating film 5 is formed on the overall mainsurface of the SOI substrate SB, the contact portions CH are provided toreach the drain layers 15 and 25 through the interlayer insulating film5, and the wiring layer WR is connected to the contact portions CH,thereby obtaining the SOI device 100 shown in FIG. 4.

<A-3. Effect>

In the SOI device 100 described above, carriers are movable between thebody regions of the MOS transistors T1 and T2 and the body fixingregions BR1 and BR2, respectively, through the SOI layer 3 under thepartial isolation insulating films PT1. This prevents the accumulationof carriers in a channel forming region, and also allows the potentialof the channel forming region to be fixed, thereby suppressing thesubstrate floating effect.

As shown in FIGS. 4 and 5, the partial isolation insulating film PT1provided between the MOS transistors in each of the NMOS region NR andthe PMOS region PR has a structure in which the portion (protrudingportion) protruding upward from the main surface of the SOI layer 3 isof greater thickness than a trench depth, namely, the portion (isolationportion) extending below the surface of the SOI layer 3, and the SOIlayer 3 (under-isolation SOI layer) under the partial isolationinsulating film PT1 is of greater thickness than the isolation portion.

Such structure can suppress an increase in parasitic capacitance of thegate electrode 12 extending over the partial isolation insulating filmPT1, which leads to favorable device operation.

Such structure also causes the proportion of the isolation portion ofthe partial isolation insulating film PT1 in the SOI layer 3 to bereduced in thickness. Accordingly, even when the thickness of the SOIlayer 3 is reduced according to a predetermined scale ratio as a resultof a scale-down of the semiconductor device, the total thickness of thepartial isolation insulating film PT1 is not reduced according to thescale ratio, but can be maintained at substantially the same thickness.

The total thickness of the partial isolation insulating film PT1, whichis greater the better from the viewpoint of suppressing the parasiticcapacitance, is practically set to twice to six times that of theisolation portion. The thickness of the isolation portion is set to lessthan half (more preferably, to one-third to one-quarter) of that of theSOI layer 3.

Since: the hybrid isolation insulating film HT1 provided between theNMOS regions NR and the PMOS region PR achieves complete electricalisolation between the two regions, as shown in FIG. 4, the occurrence oflatchup is prevented.

In addition, the manufacture is carried out effectively by forming thepartial isolation insulating film PT1 during the steps of forming thehybrid isolation insulating film HT1.

Since the source/drain layers 15 and 25 which are high concentrationimpurity regions are formed in contact with the buried oxide film 2, asshown in FIG. 4, a depletion layer comes into contact with the buriedoxide film 2 at the time of transistor operation. Accordingly, theparasitic capacitance of the source/drain is smaller than that of adevice formed on a bulk silicon substrate (bulk device), ensuringsuperiority of SOI device over bulk device.

Since the trench depth (the thickness of the isolation portion) is lessthan half of that of the SOI layer 3, less stress is applied to the SOIsubstrate in providing the isolation structure, which suppresses anabnormal junction leak current of the source/drain resulting from thestress.

The body fixing region which is a high concentration impurity region andthe body region of the transistor are electrically connected to eachother through the under-isolation SOI layer, as shown FIG. 5. It istherefore desirable that the thickness of the under-isolation SOI layerbe increased to the greatest extent practicable in each of the NMOSregion NR and the PMOS region PR in order to reduce the resistancevalue. In this respect, the structure according to this invention hasthe advantage of increasing the thickness of the under-isolation SOIlayer by reducing the thickness of the isolation portion.

In forming the source/drain layer, there is a possibility that part ofthe source/drain impurities is implanted (source/drain implantation) inthe under-isolation SOI layer through the isolation insulating film,causing a reduction of the effective concentration of impurity (ofconductivity type opposite to that of the source/drain impurities)included in the SOI layer and an increase of the resistance value of theunder-isolation SOI layer. In this respect, the structure according tothis invention again has the advantage of increasing the thickness ofthe under-isolation SOI layer thus canceling a possible increase to acertain degree of the resistance value of the under-isolation SOI layerresulting from the source/drain implantation.

<A-4. Modification>

The above description refers to a structure in which the under-isolationSOI layer is of greater thickness than the isolation portion of theisolation insulating film. Alternatively, if the resistance value of theunder-isolation SOI layer does not need to be considered, such structureis not necessarily required as long as the protruding portion of theisolation insulating film is of greater thickness than the isolationportion.

B. Second Preferred Embodiment

<B-1. Device Structure>

In the first preferred embodiment described above, the isolationinsulating films such as the partial isolation insulating films PT1 andthe hybrid isolation insulating film HT1 have the same thickness betweenthe NMOS region NR and the PMOS region PR. Alternatively, the isolationinsulating films may have different thicknesses between the NMOS regionNR and the PMOS region PR.

That is, when the gate electrodes are formed by providing a polysiliconlayer which is a gate electrode material on the overall surface of thesubstrate, and then performing selective etching at the same time in theNMOS region NR and the PMOS region PR, the doses of impurities to beimplanted in the gate electrodes (gate implantation) are differentbetween N-channel type and P-channel type, so the etching rates inmolding are different as well, resulting in gate electrode lengths ofdifferent finished dimensions.

More specifically, with the same gate width and the same thickness ofthe protruding portion of the isolation insulating film, the P-channeltype MOS transistor having a smaller gate etching rate than theN-channel type MOS transistor will have a wider gate electrode length byapproximately 10 to 20 nm.

However, the gate electrode length of the P-channel type MOS transistorcan be rendered substantially the same as that of the N-channel type MOStransistor by reducing the thickness of the protruding portion of theisolation insulating film in the PMOS region PR.

The reasons for this will be described with reference to FIGS. 13 to 17.

FIG. 13 illustrates a plan view of a gate electrode GT1 extending fromover the SOI layer 3 to over an isolation insulating film PT. Theboundary of the SOI layer 3 and the isolation insulating film PT isindicated by a broken line Y, and an isolation region is hatched.

As shown in FIG. 13, the gate electrode GT1 is formed to have inclinedside surfaces with the spreading bottom. A gate length in a bottomsurface portion of the gate electrode GT1, namely, in a portion incontact with the SOI layer 3 or the isolation insulating film PT, iswider than a gate length Lg in an upper surface portion of the gateelectrode GT1.

Assume that a gate length in a bottom surface portion of the gateelectrode GT1 on the boundary part of the SOI layer 3 and the isolationinsulating film PT is Lge, and a gate length in a bottom surface portionof the gate electrode, GT1 at the central part there of in the gatewidth direction is Lgc.

Such shape is a general phenomenon. It is desirable that the inclinationangle be close to vertical from the viewpoint of controlling the gatedimensions.

However, the reality is that the inclination is more noticeable on theboundary of the SOI layer 3 and the isolation insulating film PT. Thereason for this is believed to be that, when forming the polysiliconlayer which is a gate electrode material, the thickness of the gateelectrode material on the boundary part between the isolation insulatingfilm PT and the SOI layer 3 is increased due to step height betweenthem, which hinders uniform etching progress in the whole region.

FIGS. 14 to 16 illustrate cross-sectional views of the configuration ofthe gate electrode GT1, taken along the lines C-C, D-D, and E-E in FIG.13, respectively.

The variations in length of the gate electrode GT1 depending on thelocation thereof, as shown in FIGS. 14 and 15, may affect the operatingcharacteristics of the MOS transistor.

Assuming that a difference between the lengths Lge and Lgc (Lge−Lgc) isΔLg (range of gate length variation), it can be said that the smallerΔLg becomes, the more uniform the gate length becomes across the gateelectrode thus achieving more favorable operating characteristics of theMOS transistor.

ΔLg has a tendency to increase as the thickness of the protrudingportion of the isolation insulating film increases.

FIG. 17 shows the relationship between the range of gate lengthvariation ΔLg and a thickness (protruding thickness) Lt (FIG. 16) of theprotruding portion of the isolation insulating film.

As shown in FIG. 17, ΔLg is 40 nm when the protruding thickness Lt is100 nm, and is 20 nm when the protruding thickness Lt is 80 nm.

As such, the range of gate length variation can be reduced by reducingthe thickness of the protruding portion of the isolation insulatingfilm. This in turn prevents the widening of gate electrode length.

Utilizing this phenomenon, the gate electrode lengths of differentfinished dimensions resulting from the different gate etching rates canbe resolved.

That is, as has been described, with the same gate width and the samethickness of the protruding portion of the isolation insulating film,the P-channel type MOS transistor will have a wider gate electrodelength by approximately 10 to 20 nm than the N-channel type MOStransistor. However, by reducing the protruding thickness of theisolation insulating film in the PMOS region PR by approximately 10 to20 nm than that in the NMOS region NR, ΔLg is reduced by 10 to 20 nm, asshown in FIG. 17, thus resolving the widening of gate electrode length.As a result, the gate electrode length of the P-channel type MOStransistor can be rendered substantially the same as that of theN-channel type MOS transistor.

FIG. 18 shows an SOI device 100A as an exemplary structure in whichisolation insulating films have different thicknesses between the NMOSregion NR and the PMOS region PR. In FIG. 18, corresponding parts tothose of the SOI device 100 in FIG. 4 are referred to by the samereference numerals, to omit redundant description.

As shown in FIG. 18, a hybrid isolation insulating film HT2 thatelectrically isolates the NMOS region NR and the PMOS region PR isformed such that the protruding portion on the PMOS region PR side is ofsmaller thickness than that on the NMOS region NR side.

Accordingly, when the gate electrode 22 of the MOS transistor T2 extendsover the hybrid isolation insulating film HT2, the widening of length ofthe gate electrode 22 is prevented.

Further, the protruding portion of a partial isolation insulating filmPT2 provided between the MOS transistors in the PMOS region PR is ofsmaller thickness than that of the partial isolation insulating film PT1in the NMOS region NR.

By adopting such structure, the length of the gate electrode 22 of theP-channel type MOS transistor T2 having a smaller gate etching rate canbe rendered substantially the same as that of the N-channel type MOStransistor T1.

<B-2. Manufacturing Method>

A method of manufacturing the SOI device 100A will be described withreference to FIGS. 19 and 20.

First, the manufacturing steps of the SOI device 100 which wereexplained with reference to FIGS. 6 to 11 are performed by filling thetrenches TR1, TR11 and TR2 completely with the silicon oxide film OX2,and then polishing and planarizing the silicon oxide film OX2 by the CMPprocess to the point where at least the surface of the silicon nitridefilm SN is exposed.

Next, in a FIG. 19 step, the surface of the NMOS region NR is coveredwith a resist mask RM3, and ion implantation is performed in the wholePMOS region PR. This ion implantation should be such that boron (B),phosphorous (P), or arsenic (As) ions are implanted in a dose of1×10¹²/cm² or above. The implantation energy is set to 30 KeV or belowwhen using As, and to 10 KeV or below when using B or P, so thatimplantation damage is caused in the vicinity of the surface of thesilicon oxide film OX2.

The resist mask RM3 is removed afterward, and a hydrofluoric (HF) acidprocess is then performed. The silicon oxide film OX2 in the PMOS regionPR with the implantation damage, which has a higher etching rate tohydrofluoric acid than the silicon oxide film OX2 in the NMOS region NR,is etched at a higher speed to have the protruding portion of smallerthickness than that on the NMOS region NR side. Then, the siliconnitride film SN and the pad oxide film PDX are removed by wet etching ordry etching.

Thus obtained are the hybrid isolation insulating film HT2 having theprotruding portion on the PMOS region PR side of smaller thickness thanthat on the NMOS region NR side, and the partial isolation insulatingfilm PT2 of smaller thickness than the partial isolation insulating filmPT1, as shown in FIG. 20.

<B-3. Effect>

As described above, with the isolation insulating films of differentthicknesses between the NMOS region and the PMOS region, the gateelectrode lengths of different finished dimensions resulting from thedifferent gate etching rates can be resolved.

<B-4. First Modification>

The above description refers to a structure in which the isolationinsulating films have different thicknesses between the NMOS region andthe PMOS region. Alternatively, the isolation insulating films may havedifferent thicknesses between regions having different operatingvoltages.

Take a semiconductor device including an input/output circuit (I/O) partand a core circuit part, the I/O part having an operating voltage of 3.3V and the core circuit part having an operating voltage of 1.2 V, forexample.

In such semiconductor device, the gate electrode length of a MOStransistor is set thicker and less restricted in terms of dimensionalcontrol in the I/O part than in the core circuit part.

Thus, the protruding thickness of an isolation insulating film can beset greater and the parasitic capacitance of the gate electrode can bereduced further in the I/O part than in the core circuit part.

When the gate length in the core circuit part is set to 100 nm and thegate length in the I/O part is set to 400 nm, for example, with theabove-described range of gate length variation ΔLg being 20 nm, a ratioof dimensional variations of the core circuit part is 20/100, i.e. 20%,and a ratio of dimensional variations of the I/O part is 20/400, i.e.5%.

Therefore, if the ratio of dimensional variations up to 20% is withintolerance, the range of gate length variation ΔLg is 80 nm and itscorresponding protruding thickness of the isolation insulating filmreaches a value exceeding 100 nm in the core circuit part (FIG. 17). Theprotruding thickness in the core circuit part is 80 nm from FIG. 17.

FIG. 21 shows an SOI device 200 as an exemplary structure in whichisolation insulating films have different thicknesses between the corecircuit part and the I/O part.

As shown in FIG. 21, the SOI device 200 is provided on an SOI substrateSB consisting of a silicon substrate 1, a buried oxide film 2 providedon the silicon substrate 1, and an SOI layer 3 provided on the buriedoxide film 2.

The surface of the SOI substrate SB is divided into a core circuitregion CR (second region) and an input/output circuit region IOR (firstregion). The two regions are electrically isolated from each other by ahybrid isolation insulating film HT3.

The hybrid isolation insulating film HT3 has a substantially T-shapedcross-sectional shape that includes the FTI structure reaching theburied oxide film 2 through the SOI layer 3 at its center, and the PTIstructure having the SOI layer 3 provided thereunder at its both ends.

In the core circuit region CR and the input/output circuit region IOR,partial isolation insulating films PT3 and PT4 are provided between MOStransistors, respectively.

A MOS transistor T3 forming the core circuit region CR includes a gateinsulating film 31 provided selectively on the SOI layer 3, a gateelectrode 32 provided on the gate insulating film 31, and a sidewallinsulating film 33 provided to cover the side surfaces of the gateelectrode 32.

A source/drain layer 35 is provided in the surface of the SOI layer 3outside the sidewall insulating film 33 of the MOS transistor T3, and anextension layer 34 is provided at a shallower position than thesource/drain layer 35.

A MOS transistor T4 forming the input/output circuit region IOR includesa gate insulating film 41 provided selectively on the SOI layer 3, agate electrode 42 provided on the gate insulating film 41, and asidewall insulating film 43 provided to cover the side surfaces of thegate electrode 42. The gate insulating film 41 of the MOS transistor T4is of greater thickness than the gate insulating film 43 of the MOStransistor T3.

A source/drain layer 45 is provided in the surface of the SOI layer 3outside the sidewall insulating film 43 of the MOS transistor T4, and anextension layer 44 is provided at a shallower position than thesource/drain layer 45.

As shown in FIG. 21, the hybrid isolation insulating film HT3 thatelectrically isolates the core circuit region CR and the input/outputcircuit region IOR is formed such that the protruding portion on theinput/output circuit region IOR side is of greater thickness than thaton the core circuit region CR side.

Further, the protruding portion of the partial isolation insulating filmPT4 provided between the MOS transistors in the input/output circuitregion IOR is of greater thickness than that of the partial isolationinsulating film PT3 in the core circuit region CR.

Such structure allows a further reduction in parasitic capacitance ofthe gate electrode in the input/output circuit region IOR.

<B-5. Second Modification>

<B-5-1. First Application Example to Memory Cell Part>

Memory devices such as SRAMs (Static Random Access Memory) have a memorycell part and an operation part performing a logic operation process. Inthe memory cell part where dimensional control of a gate electrode is ofimportance, it is desirable that the protruding portion of an isolationinsulating film is of smaller thickness than those in other circuitregions including the operation part.

That is, in the memory cell part, a gate electrode is usually set tohave a width close to the processing limit for a higher degree ofintegration. Meanwhile, in other circuit regions including the operationpart, a gate electrode is set to have a wider width than that in thememory cell part.

Since the narrower the gate electrode width, the wider (thicker) thegate electrode length on condition of the same thickness of theprotruding portions of isolation insulating films, it is desirable thatthe protruding portion of an isolation insulating film in the memorycell portion have a smaller thickness by 10 to 20 nm than those in theother regions.

Such structure allows easy dimensional control of the gate electrode inthe memory cell part.

Further, the adoption of FTI structure for all isolation insulatingfilms in the memory cell part is effective at reducing the parasiticcapacitance. By doing so, the thicknesses of the protruding portions ofthe isolation insulating films can be reduced, which reduces the rangeof gate length variation and allows easy dimensional control of thegates.

When the FTI structure is adopted for all the isolation insulating filmsin the memory cell part, the substrate floating effect may exert itsinfluence on MOS transistors. Such influence is reduced effectively byusing P-channel type MOS transistors to form the memory cell part.

This is because a P-channel type MOS transistor, which has lowermobility of carriers, smaller current, and smaller accumulation ofexcess carriers in a body region than an N-channel MOS transistor, isless affected by the substrate floating effect.

In the operation part and peripheral circuits such as a decoder arrangedon the periphery of the memory cell part, the substrate floating effectmay be suppressed by using isolation insulating films having the PTIstructure and HTI structure, like the SOI device 100 which was describedwith reference to FIG. 4.

<B-5-2. Second Application Example to Memory Cell Part>

When it is not possible to form the memory cell part by usingtransistors all of which are P-channel type, like when a CMOS(Complementary MOS) inverter is included, for example, it is effectiveto adopt the FTI structure for all the isolation insulating films in thePMOS region PR in which the P-channel type MOS transistors are provided.An example of such structure will be described with reference to FIGS.22 and 23.

FIG. 22 illustrates a plan view of a region including the CMOS inverterin the memory cell. This region is divided into the PMOS region PR andthe NMOS region NR.

As shown in FIG. 22, a plurality of active regions AR are provided inparallel, and gate electrodes GT10 and GT20 are provided across theplurality of active regions AR. Both of the gate electrodes GT10 andGT20 are provided across the active regions AR in the PMOS region PR aswell as the active regions AR in the NMOS region NR, to form a commongate electrode of P-channel type and N-channel type MOS transistors thatform the CMOS inverter.

FIG. 23 illustrates a cross-sectional view of a configuration takenalong the line G-G in FIG. 22.

As shown in FIG. 23, the surface of the SOI substrate SB is divided intothe PMOS region PR and NMOS region NR which are electrically isolatedfrom each other by a hybrid isolation insulating film HT4. A fullisolation insulating film FT is provided between MOS transistors in thePMOS region PR, while a partial isolation insulating film PT5 isprovided between MOS transistors in the NMOS region NR. The gateelectrode GT10 is provided across the plurality of active regions ARwith a gate insulating film GX interposed therebetween.

The hybrid isolation insulating film HT4 has the FTI structure reachingthe buried oxide film 2 through the SOI layer 3 on the PMOS region PRside, and the PTI structure having the SOI layer 3 provided thereunderon the NMOS region NR side.

Further, the protruding portions of the full isolation insulating filmFT and the hybrid isolation insulating film HT4 in the PMOS region PRare of smaller thicknesses than those in the NMOS region NR.

By reducing the thicknesses of the protruding portions in the FTIstructures in this manner, the range of gate length variation isreduced, which allows easy dimensional control of the gates.

While the invention has been shown and described in detail, theforegoing description is in all aspects illustrative and notrestrictive. It is therefore understood that numerous modifications andvariations can be devised without departing from the scope of theinvention.

1. (canceled)
 2. A semiconductor device comprising: an SOI substrateincluding a substrate part serving as a base, a buried oxide filmprovided on said substrate part, and an SOI layer provided on saidburied oxide film; first and second element isolation insulating filmsprovided in first and second regions on said SOI layer, respectively;and a third element isolation insulating film provided between saidfirst and second regions, wherein said first and second elementisolation insulating films having a partial trench isolation structurehaving said SOI layer provided thereunder, said third element isolationinsulating film at least partly includes a full trench isolationstructure reaching said buried oxide film through said SOI layer, saidfirst and second element isolation insulting films having a structure inwhich a thickness of a protruding portion protruding upward from a mainsurface of said SOI layer is greater than a thickness of an isolationportion extending below said main surface of said SOI layer, and anN-channel type first MOS transistor provided in said first region and aP-channel type first MOS transistor provided in said second region,wherein said first and second element isolation insulating films areformed so that a thickness of an under-isolation SOI layer under saidisolation portion is of greater than a thickness of said isolationportion.
 3. The semiconductor device according to claim 2, wherein saidthird element isolation insulating film has a hybrid trench isolationstructure including said full trench isolation structure and saidpartial trench isolation structure, said partial trench isolationstructure being formed so that a thickness of said protruding portion isgreater than a thickness of said isolation portion extending below saidmain surface of said SOI layer, and a thickness of said under-isolationSOI layer is greater than a thickness of said isolation portion. 4-13.(canceled)